| 摘要 |
PROBLEM TO BE SOLVED: To provide manufacturing methods for probe, probe card and mold for probe which can manufacture accurate probes for responding to objects to be measured, such as semiconductor integrated circuits advanced in high integration and with reduced scale. SOLUTION: For the manufacturing method of the probe 100, a mold 800 with a shape corresponding to the probe 100 is formed, by pushing the mold for probe 300 to a soft material plate member 700, a plated structure 100a to be a probe 100 is formed on the mold 800 surface, and then the mold 800 is removed. COPYRIGHT: (C)2004,JPO
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