CARRIER STRIP FOR ROUND LEAD PINS AND METHOD FOR MAKING SAME

摘要

A carrier strip assembly of continuous length having transversely mounted round lead wires with an integrally formed resilient clamp on each end of each lead wire for connection with an electrical component substrate. The carrier strip provides the transporting means for the attached electrical component substrate for the assembly stages of the electrical component. The lead wires are severed from the carrier strip portion to provide outwardly extending round lead pins or external connects for interface with an electrical circuit assembly. The method for making the carrier strip assembly is disclosed.