| 摘要 |
PROBLEM TO BE SOLVED: To improve grinding efficiency by shortening the predetermined time of a grinding cycle at a workpiece and to prevent the breakage of the workpiece and a double head grinding device by detecting the abnormality of the double head grinding device with regard to the double head grinding device where both sides of the workpiece such as the glass of an optical part and a semiconductor silicone wafer are ultraprecisely ground. SOLUTION: A thrust pressure generated when the workpiece 110 is firmly fixed with the warp and deflection of the workpiece 110 absorbed is detected by two opposite grindstones 101 with the double head grinding device having a thrust static pressure pad 150, a thrust directional force detecting means 220 and a grinding spindle moving speed control means 221, the moving speed of the grinding spindle 140 is changed from fast-feed to grinding-feed by a grinding spindle moving means 180 to perform grinding. In addition, grinding can be suspended if an abnormality occurs by monitoring a thrust directional force from a grinding operation start time, thereby the breakage of the workpiece 110 and the double grinding device can be prevented. COPYRIGHT: (C)2004,JPO
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