| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device having excellent solder ball connecting strength by improving permeability of a chemical polishing treatment solution in a via hole of the tape carrier for the semiconductor device and completely removing a rustproof film. <P>SOLUTION: A method for manufacturing the tape carrier for the semiconductor device includes the steps of removing the rustproof film 25 by chemically polish treating an exposed surface of a copper foil 24 from a blind via hole 23, thereafter forming a fine wiring pattern 28 by patterning the foil 24 and providing a conductive metal layer 29 by plating on the surface of the foil 24 exposed from the blind via hole 23. The method further includes the steps of exposing the opening surface of the blind via hole 23 of an insulation film 21 as a pretreatment of the step of removing the film 25 by the chemical polishing treatment, to discharging of a corona discharging unit or a plasma discharging unit, thereby improving wettability when the film 25 is chemical polished to obtain wettability in which a contact angle of the liquid surface becomes 20°or less. <P>COPYRIGHT: (C)2004,JPO</p> |
