| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent displacement from occurring between ceramic green sheets which have via-hole conductors therein or relatively thick conductor films thereon, in a process of laminating a plurality of such ceramic green sheets and press-fitting the same in the direction of lamination for the manufacturing of an electronic array wherefrom a plurality of laminated ceramic electronic parts are acquired. <P>SOLUTION: Conductive pastes 37 and 38 which are like via-hole conductors are provided in regions corresponding to the dispensable regions 34 of ceramic green sheets 35 and 36. The conductive paste 37 and 38 are aligned in the direction of main surfaces of the neighboring ceramic green sheets 35 and 36. They do not overlap with each other in the direction of the lamination of the ceramic green sheets 35 and 36, but are preferably to join each other. <P>COPYRIGHT: (C)2004,JPO</p> |
