发明名称 Interconnect assemblies and methods
摘要 An interconnect assembly and methods for making and using the assembly. An exemplary embodiment of an aspect of the invention includes a contact element which includes a base portion adapted to be adhered to a substrate and a beam portion connected to and extending from the base portion. The beam portion is designed to have a geometry which substantially optimizes stress across the beam portion when deflected (e.g. it is triangular in shape) and is adapted to be freestanding. An exemplary embodiment of another aspect of the invention involves a method for forming a contact element. This method includes forming a base portion to adhere to a substrate of an electrical assembly and forming a beam portion connected to the base portion. The beam portion extends from the base portion and is designed to have a geometry which substantially evenly distributes stress across the beam portion when deflected and is adapted to be freestanding. It will be appreciated that in certain embodiments of the invention, a plurality of contact elements are used together to create an interconnect assembly. Various other assemblies and methods are also described below in conjunction with the following figures.
申请公布号 US6713374(B2) 申请公布日期 2004.03.30
申请号 US20000752640 申请日期 2000.12.29
申请人 FORMFACTOR, INC. 发明人 ELDRIDGE BENJAMIN N.;MATHIEU GAETAN
分类号 H01L21/768;H01L23/482;(IPC1-7):H01L21/44;H01L23/48 主分类号 H01L21/768
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