| 摘要 |
<p>964,831. Soldering. BURROUGHS CORPORATION. June 4, 1962 [June 5, 1961], No. 21513/62. Heading B3R. [Also in Division H1] A matrix of semi-conductor devices is made by supporting the devices in the positions to be occupied in the complete array, placing a printed circuit in registry with one side of the devices, and conductively bonding the devices to the circuit, and then similarly attaching a second printed circuit to the other sides of the devices. As shown, Fig. 4, a printed circuit consists of an insulating substrate 10 with conductors 12 formed on its surface. These conductors are coated with solder and flux. As shown, Fig. 3, a plurality of silicon diodes 22, each with a conductive solderable coating 28 bonded to both ends, are attached to a plate 24 by a releasable adhesive 26. The diodes may be formed by etching or ultrasonic machining. The outer ends of the diodes coated with flux 30 and then placed upon the printed circuit, Fig. 4. The assembly is then placed in a device which applies pressure to the assembly and heats the printed circuit to solder the diodes to the printed circuit. The plate 24 is then removed by dissolving the adhesive 26, and the assembly is then placed in boiling detergent, cleaned in water and/or alcohol and dried. A second printed circuit is then soldered to the exposed ends of the diodes in a similar manner. The completed assembly is etched to remove any roughness, and lead wires may be soldered to the pads 12<SP>1</SP> of the conductors 12, or the assembly may be used as a plug-in unit. As shown, Fig. 5, the device for performing the soldering operation consists of a U-shaped member 36, 38, 40, with an arm 40, carrying a pressure pad 42, pivoted at its end 44 to member 46 and biased by spring 48 towards leg 38. Leg 38 is made of metal and has a heating element 50, supplied from a source of current 54, mounted on its underside. In use, pad 42 presses plate 24 carrying diodes 22 against the printed circuit 10 which rests on the leg 38. The heat from the element 50 passes through the leg 38 and melts the coating of solder on the conductors 12.</p> |
