发明名称 PROCESSING DEVICE, AND PROCESSING DEVICE MAINTENANCE METHOD
摘要 <p>An electrode temperature adjusting device for a processing device that makes it possible to reduce the installation space and to achieve energy saving, and to prevent global warming, without using PFC as a refrigerant for a refrigerating circuit. An electrode temperature adjusting device for a processing device (100) is characterized by comprising a refrigerating circuit (110) that consists of a compressor (148), a condenser (142), an expansion valve (150), and an evaporator (108), with the evaporator being disposed within a lower electrode (106). There is no need to provide such components as a refrigerating tank for storing a refrigerant, a pump for delivering a refrigerant to the processing device, a heater for temperature adjustment of the refrigerant, and a heat exchanger for heat exchange between the primary and secondary refrigerants. For this reason, it is possible to attain cost reduction, reduction of installation space due to size reduction of the device, and energy saving. Further, using CO2 as a refrigerant ensures that the GWP is about 1/8000 - 1/7000 of that for chlorofluorocarbon.</p>
申请公布号 WO2004025199(A1) 申请公布日期 2004.03.25
申请号 WO2003JP11212 申请日期 2003.09.02
申请人 TOKYO ELECTRON LIMITED;DAIKIN INDUSTRIES, LTD.;HIROOKA, TAKAAKI;FURUYA, MASAO;TSUTSUMI, SHOHEI 发明人 HIROOKA, TAKAAKI;FURUYA, MASAO;TSUTSUMI, SHOHEI
分类号 F25B9/00;F25B39/02;F28D7/04;H01J37/32;H01L21/00;(IPC1-7):F25D17/02;H01L21/302 主分类号 F25B9/00
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