| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser along with its manufacturing method wherein laser chips of varying resonator lengths are manufactured from the same semiconductor wafer. SOLUTION: In an electrode pattern forming process, an electrode pattern 3' is formed on the upper surface of a semiconductor wafer 10. In a wafer cutting process, the semiconductor wafer 10 in which the electrode pattern 3' is formed is cut at a prescribed pitch to provide a plurality of semiconductor bars 11. In a semiconductor bar dividing process, the resulting semiconductor bar 11 is divided into prescribed chip sizes, to provide a semiconductor laser R<SB>1</SB>. The electrode pattern 3' formed in the electrode pattern forming process is continued at least in the resonator length direction A. COPYRIGHT: (C)2004,JPO
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