发明名称 |
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, EVALUATION METHOD AND PROCESS CONDITION EVALUATION METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: To provide a semiconductor device which is excellent in electrical characteristics by using silicon nitride oxide for a gate insulating film. CONSTITUTION: The gate insulating film formed from the silicon nitride oxide is located on an area in a part of a surface of a semiconductor wafer. A gate electrode is located on the gate insulating film. Source and drain areas are located on both sides of the gate electrode. A presence ratio of a nitrogen atom of which three bonds are bonded all with silicon atoms and in which remaining three bonds of each of the three silicon atoms bonded to the said nitrogen atom are bonded all with the other nitrogen atom in nitrogen atoms in the gate insulating film in a total amount of nitrogen atoms is <= 20%.
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申请公布号 |
KR20040025578(A) |
申请公布日期 |
2004.03.24 |
申请号 |
KR20030063932 |
申请日期 |
2003.09.16 |
申请人 |
FUJITSU LIMITED |
发明人 |
HORI MITSUAKI;TAMURA NAOYOSHI;SHIGENO MAYUMI |
分类号 |
G01R31/26;H01L21/28;H01L21/314;H01L21/318;H01L21/336;H01L21/66;H01L21/8234;H01L21/8238;H01L27/088;H01L29/51;H01L29/78;(IPC1-7):H01L21/336 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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