SOLDER-FILL OF SEMICONDUCTOR PACKAGE PROCESS AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A solder-fill of a semiconductor package process and a fabricating method thereof are provided to form an under-fill and mount easily a semiconductor chip on a substrate by performing only a thermal process without using a dispenser. CONSTITUTION: A solder-fill(130) of a semiconductor package process includes an under-fill material(134) and a solder bump material(132). The under-fill material(134) is used as a filling material inserted between a semiconductor chip and a substrate in the semiconductor package process. The solder bump material(132) is formed with a shape of column corresponding to a shape of a pad of the semiconductor chip in the under-fill material(134). The height of the solder bump material(132) is equal to the height of the under-fill material(134).