发明名称 Interconnection structure and method for designing the same
摘要 A wiring pattern has been enlarged by mutually different values, thereby forming two enlarged wiring patterns are formed. Then, regions where the two enlarged wiring patterns overlap each other are removed, thereby forming a dummy pattern. Alternatively, a simple-figure pattern made of simple figures is formed and a dummy pattern is formed using the simple-figure pattern. A gap that is not wider than a predetermined value is located in a final wiring pattern made of the wiring pattern and the dummy pattern is defined as an air gap region. Thus, an interconnection structure incorporating air gaps between wiring patterns is formed.
申请公布号 US6710449(B2) 申请公布日期 2004.03.23
申请号 US20020101267 申请日期 2002.03.20
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HYOTO CHIHIRO;MUKAI KIYOSHI;SHIBATA HIDENORI;TSUJIKAWA HIROYUKI
分类号 G06F17/50;H01L21/3205;H01L21/768;H01L21/82;H01L21/822;H01L23/52;H01L23/522;H01L23/528;H01L27/04;(IPC1-7):H01L23/48;H01L21/476 主分类号 G06F17/50
代理机构 代理人
主权项
地址