发明名称 |
Laminate for forming capacitor layer and method for manufacturing the same |
摘要 |
An object of the present invention is to provide a laminate for forming a capacitor layer for a printed wiring board which is capable of ensuring a higher capacitance and an inner layer core material using the laminate for example. In order to achieve this object, a material for forming a capacitor layer comprising a three-layered structure of an aluminum layer 2/a modified alumina barrier layer 3/an electrode copper layer 4 is used, such as a laminate 1a for forming a capacitor layer in which the above described modified alumina barrier layer 3 is obtained through subjecting one side of an aluminum plate or aluminum foil to an anodic treatment to form an alumina barrier layer as a uniform oxide layer and then subjecting the alumina material with the above described alumina barrier layer formed thereon to a boiling and modifying treatment in water and the above described modified aluminum barrier layer 3 is used as a dielectric layer.
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申请公布号 |
US2004053020(A1) |
申请公布日期 |
2004.03.18 |
申请号 |
US20030466886 |
申请日期 |
2003.07.22 |
申请人 |
MASHIKO YASUAKI;SEKIMORI HIDESHI;TAKAHASHI NAOTOMI |
发明人 |
MASHIKO YASUAKI;SEKIMORI HIDESHI;TAKAHASHI NAOTOMI |
分类号 |
H01G4/10;C25D11/04;C25D11/18;H01G4/12;H01G4/33;H05K1/16;H05K3/46;(IPC1-7):B05D5/12;B05D1/36;B32B3/00 |
主分类号 |
H01G4/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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