SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a package constituted of material which has characteristics of a low dielectric constant, a low dielectric loss tangent, low moisture absorption and high thermostructural property as an insulator.

SOLUTION: The semiconductor device uses resin including the compound of a (chemical formula 1)having a plurality of styrene groups (however, R shows a hydrocarbon skeleton which may have a substituent, R1shows hydrogen, methyl or ethyl, (m) shows 1 to 4 and (n) shows an integer≥2) as bridge components. Thus, the semiconductor element and the package are excellent in transmission characteristic and reduce the power consumption.

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