发明名称 |
MANUFACTURING METHOD OF CIRCUIT BOARD, AND COMMUNICATION EQUIPMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board which enables stable pattern transfer by forming a circuit pattern with a small number of processes. SOLUTION: This manufacturing method of a circuit board comprises: a process in which a resist layer 103 made of a conductor or an insulator on which a circuit pattern is formed is placed on a carrier 101, a process in which a conductive material is charged into the circuit pattern, a process in which the resist layer 103 is removed from the carrier, and a process in which the conductive material charged into the circuit pattern is transferred to an electrical insulation material 104. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004088099(A) |
申请公布日期 |
2004.03.18 |
申请号 |
JP20030287157 |
申请日期 |
2003.08.05 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KANZAWA HIDEO;YUHAKU SEI;HAYASHI YOSHITAKE |
分类号 |
H05K3/20;(IPC1-7):H05K3/20 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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