发明名称 MANUFACTURING METHOD OF CIRCUIT BOARD, AND COMMUNICATION EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board which enables stable pattern transfer by forming a circuit pattern with a small number of processes. SOLUTION: This manufacturing method of a circuit board comprises: a process in which a resist layer 103 made of a conductor or an insulator on which a circuit pattern is formed is placed on a carrier 101, a process in which a conductive material is charged into the circuit pattern, a process in which the resist layer 103 is removed from the carrier, and a process in which the conductive material charged into the circuit pattern is transferred to an electrical insulation material 104. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004088099(A) 申请公布日期 2004.03.18
申请号 JP20030287157 申请日期 2003.08.05
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KANZAWA HIDEO;YUHAKU SEI;HAYASHI YOSHITAKE
分类号 H05K3/20;(IPC1-7):H05K3/20 主分类号 H05K3/20
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