| 摘要 |
PROBLEM TO BE SOLVED: To make it easy to connect a wiring terminal formed on the base substrate of a semiconductor device to a metal layer on an insulating substrate. SOLUTION: The semiconductor device having the base substrate, resin bodies on the side and top surface of the base substrate, a plurality of semiconductor elements between the top surface of the base substrate and the resin body, and an insulating substrate between the base substrate and semiconductor elements is characterized in that the resin body on the side of the base substrate is provided with a resin body in which a plurality of wiring terminals are buried and a positioning part positioning the resin body in which the wiring terminals are buried. COPYRIGHT: (C)2004,JPO |
