| 摘要 |
PROBLEM TO BE SOLVED: To enable a wiring board having high reliability to be easily manufactured by accurately forming a fine wiring pattern. SOLUTION: A method for manufacturing the wiring board includes the steps of covering the surface of a base material 12 having an electric insulation with a copper foil 30 with a copper carrier with which the carrier 30b at the base material side is releasably covered with a copper foil 30a, perforating holes at the material 12 covered with the foil 30 with the carrier, plating the material 12 and the foil 30, forming a plating film 18 on an inner surface of a through hole 16 and the surface of the foil 30 with the carrier, then releasing the carrier 30b together with the film 18 with which the foil 30 is covered from the foil 30a, etching the foil 30a with which the surface of the material 12 is covered in a predetermined pattern, and forming a wiring pattern 20 on the surface of the material. COPYRIGHT: (C)2004,JPO
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