| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for transferring a wafer for preventing air bubbles or wrinkle from being generated between contact faces of a dicing tape and the wafer, for preventing a supporting substrate and the dicing tape from being brought into contact with each other at the time of transferring the wafer to the dicing tape, and for preventing the generation of the break, crack or deformation of the wafer at the time of handling or dicing the thin wafer and caused by the lapse of time. SOLUTION: A wafer 1 whose pattern formation face is attached to a supporting member 3 with a double-sided adhesive tape 2 (i) absorbed and supported on an absorbing table 48 while the wafer 1 is positioned at the upper part, processing to reduce the adhesive force of the double-sided adhesive tape 2 is performed to the wafer 1, and a dicing frame 5 attached with the dicing tape 4 is supplied to the wafer 1. The dicing tape 4 and the wafer 1 are attached in a vacuum, the double-sided adhesive tape 2 and the wafer 1 are peeled after the adhesion, and the wafer 1 is transferred to the dicing tape 4. COPYRIGHT: (C)2004,JPO |
