| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for working a semiconductor substrate which shows excellent expansibility with reduced impurities and which is excellent in chipping resistance in the case of working the semiconductor substrate. SOLUTION: The adhesive tape for working the semiconductor substrate is composed of an adhesive composed of a base polymer, a radiation polymerizable compound, and a radiation polymerizable polymerization initiator, and a film substrate. The film substrate is composed of a propylene resin, and its non adhesive surface is embossed and has a surface roughness Rz of≥8 micron and≤30 micron. The durometer hardness D of the film substrate ranges from 25 to 55. COPYRIGHT: (C)2004,JPO |
