| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer interconnection structure which can regulate a substrate thickness having excellent handleability and conveyability in a manufacturing process and which facilitates a mass production, and to provide a method for mounting a semiconductor device. SOLUTION: The method for manufacturing the multilayer interconnection structure includes the steps of partly adhering and bonding a carrier plate 3 to a metal base 1 at an adhesive part 5 by an adhesive resin 4, forming a multilayer interconnection having a first metal pad 8, an insulating resin 7 and a second metal pad 6 on the base 1, and separating the base 1 from the plate 3 by cutting the adhered part 5 at a cutting part 9. COPYRIGHT: (C)2004,JPO
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