| 摘要 |
PROBLEM TO BE SOLVED: To suppress adverse influences of irregular reflection in a package which is caused by the reflection from a window glass on the output side of a semiconductor light emitting device. SOLUTION: In the semiconductor light emitting device, the light Lf output from a semiconductor light emitting element 19 arranged in a package 13 penetrates a translucent sealing member 15 formed in a window 14 opened in the package 13. and output. In a part of the sealing member except a region A which the light Lf output from the light emitting element 19 penetrates, a light absorbing film 21 for absorbing the light Lb output from the light emitting element 19 is formed. The irregular reflection component in the package 13 is absorbed by the light absorbing film 21. COPYRIGHT: (C)2004,JPO
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