SEMICONDUCTOR WAFER DRYING APPARATUS USING VAPOR-DRY METHOD

摘要

PURPOSE: A semiconductor wafer drying apparatus using a vapor-drying method is provided to restrict an adhering phenomenon between semiconductor wafers by using a pitch guide for fixing the semiconductor wafer. CONSTITUTION: A semiconductor wafer drying apparatus using a vapor-drying method includes a bath(300), a chamber(400), a vapor supply line(404), a discharge line(402), a deionized water discharge line(406), a wafer support(304), and a plurality of pitch guides(306,308). The bath(300) is used for storing the deionized water. The chamber(400) provides the predetermined internal area for moving the steam. The vapor supply line(404) is used for supplying the steam into the predetermined internal area of the chamber. The discharge line(402) is used for discharging the vapor of the chamber to the outside. The deionized water discharge line(406) is used for discharging the deionized water of the chamber to the outside. The wafer support(304) is used for supporting a semiconductor wafer. The pitch guides(306,308) are installed at both sides of the wafer support.