摘要 |
In the manufacture of electronic devices (20, 20'), e.g. discrete semiconductor power devices or ICs, a reversible bonding tool (10) is used having a bonding tip or wedge (1, 2) at each of its opposite ends (11, 12). After extensive use of the wedge-tip (1) at one end (11) for bonding wires (21), the tip (1) is worn. Instead of needing to replace the bond tool as in the prior art, the tool (10) in accordance with the invention is then reversed to use the wedge-tip (2) at the opposite end (12) for bonding further wires (21'). |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V.;VASQUEZ, RAMIL, N.;ABADILLA, ESTEBAN, L.;ROGADO, ALEXANDER, M.;LICTAO, CRISPULO, JR. |
发明人 |
VASQUEZ, RAMIL, N.;ABADILLA, ESTEBAN, L.;ROGADO, ALEXANDER, M.;LICTAO, CRISPULO, JR. |