发明名称 |
Chemical mechanical polishing pad with micro-holes |
摘要 |
Disclosed is a chemical mechanical polishing pad formed at a polishing surface thereof with micro-holes each having a desired cross-sectional area while having a desired depth. The shape, size, and density of the micro-holes can be optionally adjusted. The chemical mechanical polishing pad provides an effect of maintaining a desired polishing rate during a polishing process. In accordance with the present invention, the micro-holes can have diverse arrangements depending on given process conditions.
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申请公布号 |
US2004048559(A1) |
申请公布日期 |
2004.03.11 |
申请号 |
US20030110801 |
申请日期 |
2003.06.12 |
申请人 |
PARK INHA;KWON TAE-KYOUNG;KIM JAESOK |
发明人 |
PARK INHA;KWON TAE-KYOUNG;KIM JAESOK |
分类号 |
B24B37/00;B24B37/04;B24D13/14;H01L21/302;H01L21/304;(IPC1-7):B24B7/22 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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