发明名称 METHOD FOR MANUFACTURING RIGID FLEXIBLE MULTILAYER PRINTED WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To manufacture a rigid flexible multilayer printed wiring board in which a part of an insulating layer in a predetermined region is removed to make the region flexible, wherein it can be made easy to remove the insulating layer with a good positional accuracy and coat the insulating layer of a flexible part printed wiring. <P>SOLUTION: In an inner layer printed wiring board 1 when a metal foil is etched to form a printed wiring, the metal foil of a predetermined region is left behind as a screening metal foil 3'. The printed wiring is formed on an opposite surface of the corresponding inner layer printed wiring board 1. A prepreg 2 and the metal foil 3 are overlapped on the inner layer printed wiring board 1, and they are integrated by a heat and pressure formation. Thereafter, a region of the metal foil 3 of a surface corresponding to the screening metal foil 3' is removed, laser beams are irradiated so as to reach from an insulating layer 2' of an exposed outer layer to the screening metal foil 3', and the insulating layer 2' over the screening metal foil 3' is removed. Further, the screening metal foil 3' is etched and removed. The region becomes a flexible part 6. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004079780(A) 申请公布日期 2004.03.11
申请号 JP20020238007 申请日期 2002.08.19
申请人 SHIN KOBE ELECTRIC MACH CO LTD 发明人 NODA MASAYUKI;HARADA ISAO;MARUMOTO TORU
分类号 H05K1/02;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/02
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