| 摘要 |
PURPOSE: A stack package structure and a method for manufacturing the same are provided to have light and small size by stacking an upper and a lower chip after back-grounding the back surface of the upper and the lower chip. CONSTITUTION: A first interconnection connected to a first chip pad and a first protection layer are formed on an upper chip(100). A lower chip(200) includes a second interconnection having a ball land(210) connected to a second chip pad, and a second protection layer so as to expose the ball land(210). The back surface of the lower chip(200) is back-grounding. An adhesive(220) is formed between the back surfaces of the upper chip(100) and the lower chip(200). A molding body(240) is covered to the resultant structure so as to expose the ball land(210). A conductive ball(242) is attached to the ball land(210).
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