发明名称 |
Semiconductor wafer |
摘要 |
A plurality of IC chips each having an internal circuit are mounted on a wafer substrate. A plurality of scribe lines are formed on the wafer substrate for separating the IC chips from one another. A plurality of inspection pads are formed on the scribe lines. Each of the inspection pads is connected to the associated internal circuit via a conduction path for inspecting an operation of the associated IC chip.
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申请公布号 |
US6703251(B2) |
申请公布日期 |
2004.03.09 |
申请号 |
US20020267783 |
申请日期 |
2002.10.10 |
申请人 |
MITSUMI ELECTRIC CO., LTD. |
发明人 |
TERADA YUKIHIRO;MIKI KENICHI |
分类号 |
G01R31/28;H01L21/66;H01L21/822;H01L23/485;H01L23/58;H01L27/04;(IPC1-7):H01L27/10 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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