| 发明名称 |
CIRCUIT DEVICE AND ITS PRODUCING PROCESS |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent outflow of a solder material 19 from a die pad 11. <P>SOLUTION: A groove 14 is made in the peripheral part on the surface of the die pad 11 to surround a region for mounting a semiconductor device 13. In the production step for mounting the semiconductor device 13 on the die pad 11 through the solder material 19, the solder material 19 spreads when the semiconductor device 13 is mounted on the fused solder material 19 but the groove 14 functions as a region for blocking outflow. Consequently, short circuit of the die pad 11 and a bonding pad 12 due to the spread solder material 19 can be prevented. <P>COPYRIGHT: (C)2004,JPO |
| 申请公布号 |
JP2004071898(A) |
申请公布日期 |
2004.03.04 |
| 申请号 |
JP20020230409 |
申请日期 |
2002.08.07 |
| 申请人 |
SANYO ELECTRIC CO LTD;KANTO SANYO SEMICONDUCTORS CO LTD |
发明人 |
TAKAHASHI YUKITSUGU;SAKAMOTO NORIAKI |
| 分类号 |
B23K1/14;B23K35/30;B23K101/42;H01L21/50;H01L21/58;H01L21/60;H01L23/12;H01L23/28;H01L23/48;H01L23/50;H05K3/00 |
主分类号 |
B23K1/14 |
| 代理机构 |
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