| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem of difficulty of high-speed of an X-Y stages and a lifting mechanism of a mounting stage, and further high-speed checking when a contact loading increases and the mounting stage rises in stiffness and in weight, in which the mounting stage is located on the X-Y stages in a conventional probe device. <P>SOLUTION: The driving device of a mounting stage includes a horizontal driving mechanism 17 for moving a mounting stage 11, on which a wafer is mounted, horizontally, and a lift driving mechanism 14 for moving the mounting stage 11 vertically. The lift driving mechanism 14 includes a first lifting mechanism 18 for supporting the horizontal driving mechanism 17 and lifting the the horizontal driving mechanism 17, and a second lifting mechanism 19 for supporting the mounting stage 11 on the horizontal driving mechanism 17 and lifting the mounting stage 11 in minute length through a piezo-electric element 19B. <P>COPYRIGHT: (C)2004,JPO |
