| 摘要 |
PROBLEM TO BE SOLVED: To realize a single heat sink that can be fixed to a plurality of electronic components or a heat sink that can be fixed to an electronic component which is not parallel with the heat sink body. SOLUTION: The thermally actuated self-matching heat sink comprises the heat sink body (808) including a cavity (814) on the bottom face thereof, a floating pedestal (806) having an upper surface in the cavity (814) and a bottom surface touching the upper surface of a heat releasing device (800) and being caught movably by the heat sink body (808), and some quantity of heat material (810) interposed between the upper surface of the floating pedestal (806) and the cavity (814). When the heat material (810) is heated over the melting point and a compressive force is applied to the heat sink body (808) and a substrate (802), the heat material (810) melts to fill the cavity (814) substantially. COPYRIGHT: (C)2004,JPO |
