发明名称 |
SLOTTED SUBSTRATES AND METHODS AND SYSTEMS FOR FORMING SAME |
摘要 |
Methods and systems for forming slots in a print head substrate having a thickness defined by opposing first and second surfaces. In one exemplary embodiment, a trench is received in the first surface and extends through less than an entirety of the thickness of the substrate. A plurality of slots extends into the substrate from the second surface and connects with the trench to form a compound slot through the substrate. In this embodiment, the trench is wider at portions proximate to said slots than at portions more distant to said slots. |
申请公布号 |
SG102071(A1) |
申请公布日期 |
2004.02.27 |
申请号 |
SG20030001195 |
申请日期 |
2003.03.07 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
JEFFREY R. POLLARD |
分类号 |
B41J2/05;B41J2/14;B41J2/16;(IPC1-7):B41J2/05;B41J2/19 |
主分类号 |
B41J2/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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