| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a means of suppressing slid friction of a work generated on a mount tool surface to provide a method for bonding a semiconductor chip which uses an ultrasonic joining method of preventing wear of the mount tool surface, and making reliability and productivity compatible and a bonding apparatus used for the method. <P>SOLUTION: While ultrasonic vibration is applied to an area to be processed for joining, a vibration axial holding force and a force of inertia are controlled according to information from a control managing means to perform joining processing while maintaining a relation of (vibration axial holding force)>(die shear strength)+(force of inertial). <P>COPYRIGHT: (C)2004,JPO |
