发明名称 METHOD FOR MANUFACTURING SUBSTRATE, AND OPTOELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To easily manufacture a substrate device comprising two substrates, one of which is thicker than the other, at low cost in high manufacture yield without any defect. <P>SOLUTION: A surface of a first substrate (200) is etched only at the circumferential part to make the external shape of the center part other than the circumferential part smaller than that of the circumferential part and also forms a collar part E including the circumferential part. Because of the presence of the collar part E, the first substrate and second substrate (200') can be fixed with the same jig J. The collar part E is removed in a process of making the first substrate thin. Consequently, the substrate device is manufactured which has the second substrate large in external shape than the first substrate. The first substrate which is made thin never chips. This manufacturing method is suitably applied to formation of macrolenses on the first and second substrates. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004061708(A) 申请公布日期 2004.02.26
申请号 JP20020217914 申请日期 2002.07.26
申请人 SEIKO EPSON CORP 发明人 SAITO HIROMI
分类号 G02F1/13;G02B3/00;G02F1/1333;G02F1/1335 主分类号 G02F1/13
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