| 摘要 |
PROBLEM TO BE SOLVED: To electrically connect both surfaces of a printed wiring board without increasing the number of manufacturing processes nor raising a cost. SOLUTION: There are provided a step for forming a through hole 2 on an insulating film layer 1, a step for forming a conductivity providing layer 3 on the front surface of the insulating film layer 1 and on the side surface of the through hole 2, and a step for forming a copper plated layer 4 by electrolytic-copper-plating on the conductivity providing layer 3. Thus, a copper film layer used for forming a circuit is formed on the insulating film layer 1 while the through hole 2 is copper-plated. Accordingly, both surface of the printed circuit board are electrically connected through the through hole part without increasing the processes required for manufacturing the printed wiring board nor rasing a cost. COPYRIGHT: (C)2004,JPO
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