发明名称 LEAD-FREE LOW MELTING GLASS AND SEALING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an amorphous low melting glass useful for sealing, which is free from lead and is used for adhesion sealing various members at a low temperature of≤400°C, and a sealing material obtained by using the glass. SOLUTION: The low melting glass for sealing does not contain lead substantially and has a composition comprising, by molar percentage, 50-75% SnO, 10-45% P<SB>2</SB>O<SB>5</SB>, and 0.1-20% Cl. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004059366(A) 申请公布日期 2004.02.26
申请号 JP20020219286 申请日期 2002.07.29
申请人 ASAHI TECHNO GLASS CORP 发明人 SUGIURA RYOSUKE
分类号 C03C3/23;C03C3/06;C03C8/06;C03C8/08;C03C8/14;C03C8/24;(IPC1-7):C03C3/23 主分类号 C03C3/23
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