| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a solid-state image sensing device which is easily manufactured, improved in reliability, and reduced in size by forming an optical member such as a lens having a light condensing function and a peripheral circuit board into an integral structure. SOLUTION: A first semiconductor substrate 101 where a solid-state image sensing element is provided, a transparent member 220 which is connected to the semiconductor substrate 101 as confronting the light receiving region of the solid-state image sensing element through the intermediary of a space, and a second semiconductor substrate 901 forming a peripheral circuit, are formed into an integral structure together with an optical member such as a lens having an optical function for the formation of the solid state image sensing device. COPYRIGHT: (C)2004,JPO
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