| 摘要 |
FIELD: polymer compounds. SUBSTANCE: invention relates to epoxide compositions for obtaining foam compound used for filling gaps, electric insulation, and strengthening unpackaged and packaged electric connectors by filling, for sealing and protecting elements of radio-electronic facilities, for smoothening deficient heat-insulation surfaces, and gluing metal and nonmetal parts with large alternating-sign gaps. Composition contains 4,4'-isopropylidenediphenol epoxide resin, polyoxypropylenetriol triglycidyl ether, ethylenediaminomethylphenol, foam regulator, and polyhydroxysilane. Alternatively, composition contains 4,4'- isopropylidenediphenol epoxide resin, polyoxypropylenetriol triglycidyl ether, foam regulator, and polyhydroxysilane. In order to obtain foam compound, part of hardener (ethylenediaminomethylphenol) is substituted with low-molecular polyamide resin and aliphatic polyamines. EFFECT: increased compression and tearing strength. 2 cl, 3 tbl |
