CLOSED LOOP MATERIAL PRESSURE CONTROL FOR THE ENCAPSULATION PROCESS OF ELECTRONIC COMPONENTS

摘要

A transfer mold apparatus comprising at least one mold cavity, at least one resin chamber (3), and at least one channel (4) communicating between the at least one mold cavity and the at least one resin chamber (3); a piston (8) in communication with each resin chamber to force the resin through the at least one channel (4) into the at least one mold cavity; and a device to drive the piston (8); further comprising at least one pressure transducer (13) connected to at least one channel (4) and positioned to determine the pressure in the channel (4) . A method for encapsulating electrical components comprising placing resin into a chamber of a molding device; applying a compressive force to the resin to force the resin through (4) channels into mold cavities; measuring the pressure in at least one channel (4) using a pressure transducer (13); determining the amount of compressive force to apply to the resin based an the pressure measured by the pressure transducer (13); and adjusting the compressive force based thereon.