| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite modular component which can be easily reduced in size and is surely and easily mounted on a mother board, even if a chip part is mounted on the rear surface of the composite modular component. SOLUTION: The end face electrodes of the chip part 3, mounted on the rear surface of the composite modular component 5, are used as the electrodes of the composite module component 5, when the composite modular component 5 is mounted on the mother board 4. By this constitution, since the end face electrodes of the chip part 3 mounted on the rear surface of the composite modular component 5 can be used as the electrodes of the composite module component 5, the composite modular component 5 can be surely mounted on the mother board 4 and in a simple structure, and the chip part 3 can be mounted on the rear surface of the composite module component 3, so that the composite module component 5 can be reduced in size. COPYRIGHT: (C)2004,JPO
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