Low inductance circuit arrangement for power semiconductor modules

摘要

The circuit device has an electrically-insulating substrate (10) provided with relatively insulated metallized connector paths (12) with associated power semiconductor elements (13), at least 2 DC terminal leads (20a,20b) and at least one AC terminal lead (30). The DC terminal leads of opposite polarity lie in close proximity to one another, both the DC and AC terminal leads exending parallel to the substrate surface and/or the connector paths and relatively insulated from the latter and provided with surface elements (21,31) for bonding wire connections (40,41) with the semiconductor elements or the connector paths.