发明名称 Method for manufacturing laminated electronic component
摘要 A method for manufacturing a laminated electronic component, in which magnetic layers and conductive patterns for coil are sequentially provided, a coil pattern is enclosed between the magnetic layers inside a laminated body, and a nonmagnetic section is provided between adjacent conductive patterns for coil, the coil pattern being provided by repeatedly performing: a first step of providing a second magnetic layer over the entire top face of a first magnetic layer, which a first conductive pattern for coil is provided on; a second step of providing a loop-shaped groove in the second magnetic layer by using laser processing; a third step of providing a nonmagnetic section in one portion of the loop-shaped groove; and a fourth step of printing a second conductive pattern for coil so that one end section thereof overlaps the end section of the first conductive pattern for coil and the other end section extends to the surface of the nonmagnetic section.
申请公布号 US6692609(B2) 申请公布日期 2004.02.17
申请号 US20010985379 申请日期 2001.11.02
申请人 TOKO KABUSHIKI KAISHA 发明人 KOBAYASHI SEIICHI;NAGASAWA TADAYOSHI;NOGUCHI YUTAKA;MORI HIROYASU;SAKAKURA MITSUO
分类号 H01F17/00;H01F41/04;(IPC1-7):H01F17/00 主分类号 H01F17/00
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