| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure of an electronic unit which can practice cooling with a high efficiency, while a moisture-proofness of the electronic unit is maintained. SOLUTION: An electronic component is housed in a case 21 of the electronic unit 20, and a connector 26 connected to the electronic component is provided in the case 21. A cooling air path 14, through which cooling air flows, is formed in a main part 11 and the electronic unit 20 is cooled by the cooling air. A linkage hole 15, via which the outside of the main part 11 is linked with the cooling air path 14, is formed in the main part 11. The case 21 of the electronic unit 20 is inserted into the linkage hole 15 so as to have a part of the case 21 provided in the cooling air path 14, and a part of the case 21 including the connector 26 provided outside the cooling air path 14. A sealing member 30, which restricts the flow-out of the cooling air from the inside of the cooling air path 14 to the outside thereof, is provided between the case 21 and the linkage hole 15. |
