SEMICONDUCTOR DEVICE AND ITS FABRICATING METHOD

摘要

PURPOSE: To improve the process yield of a semiconductor device suitable for multiple pins. CONSTITUTION: The semiconductor device includes semiconductor chips arranged with a plurality of electrodes in their main surface, a plurality of leads each coupled electrically to a plurality of the electrodes of the semiconductor chips, and a resin sealant for sealing the semiconductor chips and a plurality of the leads, which include first leads that is exposed from a mounting surface of the resin sealant and have first external coupling portions positioned in a side surface of the resin sealant and second leads that are adjacent to the first leads and are exposed from the mounting surface of the resin sealant sealing and are besides provided with second external coupling portions positioned nearer to a side of the semiconductor chips than the first external coupling portions. The first and second leads are adhered and fixed to the semiconductor chips.