发明名称 |
Wafer inspection methods and an optical inspection tool |
摘要 |
A method of inspecting a plurality of wafers in an optical inspection tool. The method includes the steps of generating a reference wafer and polishing the reference wafer in a chemical mechanical polishing process following a metal deposition process such that the reference wafer is representative of a fully polished wafer. The optical inspection tool scans the reference wafer and a gray level map is generated. A number of further wafers are metalized, polished, scanned and gray level maps generated. The method includes the step of comparing a gray level map of the scanned reference wafer to a number of gray level maps of the scanned wafers. A determination (314) is then made as to whether the wafer exhibits an acceptable polishing quality based on the comparison.
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申请公布号 |
US2004028267(A1) |
申请公布日期 |
2004.02.12 |
申请号 |
US20020215523 |
申请日期 |
2002.08.08 |
申请人 |
APPLIED MATERIALS ISRAEL LTD |
发明人 |
SHOHAM DORON;RECHES OREN |
分类号 |
G01N21/95;G01N21/956;G06T7/00;(IPC1-7):G06K9/00 |
主分类号 |
G01N21/95 |
代理机构 |
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