| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating process which promotes removal of microbubbles from a wafer, inhibits pit defects, prevents malfunction of a device, etc. and improves production yield when forming wiring on the semiconductor wafer through electroplating or electroless plating, and the semiconductor wafer with few pit defect. SOLUTION: The plating process is for forming the wiring on the semiconductor wafer, etc. wherein plating is performed in a plating tank which is depressurized to below atmospheric pressure. In the process and a plating apparatus, the plating tank is depressurized by sealing the tank and exhausting the space in the upper part of the tank using a vacuum pump. COPYRIGHT: (C)2004,JPO
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