| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an antenna coil configuration for IC card, with which blocking is not caused, adhesion with an outer layer can be improved and which does not have an apparent problem, and to provide a manufacturing method of the configuration and an IC card provided with the configuration. <P>SOLUTION: The antenna coil configuration for IC card 10 is provided with a resin film base material 11 comprising amorphous polyethylene terephthalate (APET) on a surface and a circuit pattern layer 13 comprising metal foil formed to touch a surface of the base material 11. The resin film base material 11 is fixed on a surface of metal foil by thermobonding or melting extrusion bonding. At least a part of metal foil is etched by using a resist ink layer as a mask. Thus, the circuit pattern layer 13 is formed and the resist ink layer is removed. The IC card is provided with the outer layer formed to cover the IC chip loaded on the antenna coil configuration for IC card 10. <P>COPYRIGHT: (C)2004,JPO |
