| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device not necessitating data forwarding about defective circuits, to provide a method for manufacturing the same, and to provide a method for inspecting the same. <P>SOLUTION: This semiconductor device comprises a semiconductor substrate 1 having a semiconductor circuit connecting pad 3, a rerouted wire 4 formed on the semiconductor substrate 1 and electrically connected to the connecting pad 3, a bump 8 electrically connected to the rerouted wire 4, and a protective film 7 formed on the rerouted wire 4 except where the bump 8 is provided. In the device, an opening 9 is provided at a specified location in the protective film 7, and the part of the rerouted wire 4 exposed out of the opening 9 is used as an inspection pad 10. Since the connecting pad 3 and the inspection pad 10 are electrically connected, electrical inspections may be conducted for semiconductor circuits on the semiconductor substrate 1 even after the development of the device into a CSP. This dispenses with the step of forwarding failure data to later processes because defective devices are marked directly. <P>COPYRIGHT: (C)2004,JPO</p> |
