发明名称 |
Method for protecting electronic or micromechanical components |
摘要 |
A method of protecting electronic or micromechanical components having at least one contact face for electric contacting is described. Sensitive components such as electronic microchips having bond pads, for example, are protected from soiling and corrosion. This method includes the application of an organic protective layer at least to the contact faces of the components. |
申请公布号 |
US2004026775(A1) |
申请公布日期 |
2004.02.12 |
申请号 |
US20030399253 |
申请日期 |
2003.09.09 |
申请人 |
HECHT HANS;MUELLER LUTZ;STARK ANDREAS;STEINER WERNER |
发明人 |
HECHT HANS;MUELLER LUTZ;STARK ANDREAS;STEINER WERNER |
分类号 |
H01L23/00;H01L23/31;H01L23/485;(IPC1-7):H01L23/053;H01L23/12 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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