| 摘要 |
PROBLEM TO BE SOLVED: To provide a sucking device capable of sucking a warped substrate. SOLUTION: The warp of the substrate to be fixed to this sucking device is measured beforehand, and of the front surface and back surface of a supporting body 11, the front surface 12 is formed into a curved shape recessed at a position where the back surface of the substrate is raised and raised inversely at a position where it is recessed so that the back surface of the substrate can be tightly adhered to the front surface 12. The electrodes 15a and 15b of fixed film thickness are arranged on the front surface 12, the film thickness of a protective layer 17 formed on the surface of the electrodes 15a and 15b is also fixed, the three-dimensional shapes of a virtual surface 13 where the surface of the electrodes 15a and 15b is positioned and the virtual surface where the surface of the protective layer 17 is positioned are equal to the front surface 12, and thus the substrate is tightly adhered to the surface of the protective layer 17. COPYRIGHT: (C)2004,JPO |
