发明名称 CURABLE COMPOSITION AND ELECTRICAL AND ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide a curable composition which forms a cured material flexible even at a low temperature, scarcely suffers bleeding of a free oil component from a gel due to a stress by e.g. fluctuations in pressure, and a thermal history, and is excellent in chemical resistance, and electrical and electronic parts. SOLUTION: The curable composition contains (A) 100 pts.wt. of an alkenylated fluoropolymer containing-[CF(CF<SB>3</SB>)-CF<SB>2</SB>-O]-units, (B) 20-40 pts.wt. of a nonfunctional fluoropolymer which does not contain an alkenyl group and contains-[(CF<SB>2</SB>)<SB>k</SB>O]-units (wherein k is 1 to 6), (C) an organohydrogensiloxane compound having two or more hydrogen atoms bonded to a silicon atom, in an amount sufficient for curing, and (D) a platinum group metal catalyst in an amount sufficient as a catalyst. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004043590(A) 申请公布日期 2004.02.12
申请号 JP20020201349 申请日期 2002.07.10
申请人 SHIN ETSU CHEM CO LTD 发明人 FUKUDA KENICHI;SHIONO MIKIO
分类号 C08L71/00;C08G65/336;C08K5/541;C08L71/02;H01L23/29;H01L23/31;(IPC1-7):C08L71/00 主分类号 C08L71/00
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